| 摘要 |
<p>A method and apparatus are provided for electrostatically applying a coating, such as solder mask, to a substrate 16 such as a circuit board. A grounded conveyor system includes electrically conductive means 22 for suspending the substrate from the conveyor and grounding the substrate. An atomizing spray nozzle 10 provides an atomized, electrically charged spray of the coating material in the direction of the grounded substrate 16. A focusing element 12 is positioned to confine the spray to a desired pattern 14, and a receiving backplate 18, which carries a charge opposite that of the spray, is positioned behind the substrate 16 to attract the charged coating particles that do not impinge on the substrate 16. <IMAGE></p> |
