LEAD FRAME HAVING HEAT SLUG

摘要

PURPOSE: A lead frame is to dissipate heat from a highly integrated silicon chip in a semiconductor package and to reduce burr present on outside of the semiconductor package without addition of any equipment. CONSTITUTION: A lead frame having a packaging region comprises: a die pad(110) in the packaging region; a lead(128) arranged around of the die pad; a heat slug(200) present outside of the packaging region; a tie bar(120) attached to the die pad; and a pair of side rails which support the lead and the heat slug in addition to tie bars not connected to the heat slug. A part of each lead is placed in the packaging region whereas at least one of the tie bars connects the die pad to the heat slug. After a silicon chip(100) is bonded to a surface of the die pad, a wire bonding operation is accomplished. A conductive wire(132) is connected from a bonding pad on the silicon chip to an inner lead part(115) of the lead.