APPARATUS FOR TESTING CHIP WITH EXISTING TEST APPARATUS AND TEST METHOD THEREOF

摘要

PURPOSE: An apparatus is provided to test a produced chip with a chip level test method. CONSTITUTION: A chip is placed on an inner lead(10) to align a flip chip bump(50) and an inner lead. An intermediate layer(35) is placed on an inner lead to connect between a flip chip bump and an inner lead electrically. If an intermediate layer is made of a flux, a wettability material plated on a lead frame(500) gathers around surface of a flip chip bump after thermal process. If an intermediate layer is made of a lead paste, both of a wettability material and a lead paste are melted after thermal process. A lead paste starting to melt around a flip chip bump flows to surface of a lead frame because of its surface tension. Then a connection part is formed between a flip chip bump(50) and an inner lead. An used material depends on a height difference level between a selected bump and rest bumps.