SEMICONDUCTOR DEVICE

摘要

A semiconductor device comprising a metal substrate, a plurality of wires fixed to the metal substrate with an insulating layer interposed therebetween, and a power circuit connected electrically to the plurality of wires. The power circuit has a plurality of circuit portions connected electrically between the wires. The circuit portions have a plurality of terminals integral therewith, the terminals being bonded to a plurality of wires. The inventive semiconductor device constitutes a power semiconductor module of high reliability fabricated at low cost.