发明名称 AUTOMATIC TEACHING COMPENSATION APPARATUS FOR SEMICONDUCTOR MAPPING MACHINE
摘要 PURPOSE: An apparatus is provided to increasing a mapping accuracy by matching mapping sensors placed at both sides of the apparatus automatically. CONSTITUTION: A mapping unit(20) detects a loading state of a wafer(W) after loading it to each cassette with a robot unit(10). For this operation, a laser oscillator(21) radiates laser beam to a beam splitter(22). The mapping sensors(160) detecting the splitted beam adjust positions of the robot unit and mapping unit to perform a next mapping operation. If an abnormal mapping operation occurs, the mapping sensors of robot unit are reassembled. In that case, each photo sensor(162) recognizes a present position with reference parts(161) and provides a corresponding signal to a main board. The main board controls a step motor(130) placed under the mapping sensor to place the mapping sensors in the horizontal line so a correct position compensation is achieved as well as reducing the reassembling time.
申请公布号 KR20000051300(A) 申请公布日期 2000.08.16
申请号 KR19990001655 申请日期 1999.01.20
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 SHIN, GWANG HO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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