| 摘要 |
<p>An electrostatic chuck (11), which includes a plurality of ejector pins (16), means of moving up and down the ejector pins and means of grounding the ejector pins, is provided with an ejector buffer mechanism disposed between the ejector pins and the ejector pin moving means for exerting a buffer action for the tip positions of individual ejector pins. The electrostatic chuck facilitates the positioning control of the ejector pins and enables the ejector pins to come in tight contact with the wafer rear surface, and consequently the wafer can be clamped and released quickly and reliably. At the plasma processing of wafer, the ejector pins are brought to tight contact with the wafer rear surface, or a clearance within a prescribed range is created for the ejector pins from the wafer rear surface, thereby suppressing the occurrence of discharge in the gap between an ejector pin and the wafer rear surface, and consequently problems associated with the discharge can be dissolved.</p> |
