发明名称 LASER DIODE MODULE ATTACHMENT DEVICE
摘要 PURPOSE: A laser diode module attachment device is provided to enable users to insert a laser diode into a socket of a board as to reliability tests of a laser diode module which injects laser beam from an optical disk player. CONSTITUTION: A laser diode module attachment device includes the following components. A base(100) enables a fixed block (110, 360) to slide. A main block(200) enables a fixed block(110, 360) to slide. A chucking method selectively chucks caps(11) of a laser diode module(10). A lid fixed method supports a lid of a laser module that was connected to the main block(200) through auxiliary block and was chucked by a chucking method so as to maintain its flat level. A primary pressurization method pressurizes a laser diode module(10) towards a socket(4). A secondary pressurization method perfectly attaches a laser diode module(10) to a socket(4). The device enable users to attach a laser diode module(10) to a socket(4) much more easier than before. Because users can adjust a lid when attaching, changes in the status of lids can be prevented.
申请公布号 KR20000051705(A) 申请公布日期 2000.08.16
申请号 KR19990002283 申请日期 1999.01.25
申请人 SAMSUNG ELECTRO MECHANICS CO., LTD. 发明人 CHOI, IN KYU
分类号 H01S3/02;(IPC1-7):H01S3/02 主分类号 H01S3/02
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