发明名称 |
STABILIZED DEVICE OF SLURRY FOR WAFER POLISHING |
摘要 |
PURPOSE: A stabilized device of a slurry for a wafer polishing is provided by stabilization of the slurry through precipitating the large particles of the slurry in a supplying equipment of the slurry. CONSTITUTION: A method of manufacturing the stabilized device of the slurry for the wafer polishing consists of: a stabilized device of the slurry to be installed between the transferring lines of the slurry from a supply unit(drum unit) to a mixing module; the first precipitation unit to store and stabilize the slurry to be flowed in from the drum unit; the second precipitation unit to stabilize the stabilized slurries to be supplied from the first precipitation unit during transferring continuously; the outlet pipes to be connected to the bottoms of the first and the second precipitation units, and to exhaust the precipitation on the bottom of units.
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申请公布号 |
KR20000051800(A) |
申请公布日期 |
2000.08.16 |
申请号 |
KR19990002439 |
申请日期 |
1999.01.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG, SA MUN;KIM, SU RYEON;KIM, SEUNG EON;LEE, JIN SEON |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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