发明名称 STABILIZED DEVICE OF SLURRY FOR WAFER POLISHING
摘要 PURPOSE: A stabilized device of a slurry for a wafer polishing is provided by stabilization of the slurry through precipitating the large particles of the slurry in a supplying equipment of the slurry. CONSTITUTION: A method of manufacturing the stabilized device of the slurry for the wafer polishing consists of: a stabilized device of the slurry to be installed between the transferring lines of the slurry from a supply unit(drum unit) to a mixing module; the first precipitation unit to store and stabilize the slurry to be flowed in from the drum unit; the second precipitation unit to stabilize the stabilized slurries to be supplied from the first precipitation unit during transferring continuously; the outlet pipes to be connected to the bottoms of the first and the second precipitation units, and to exhaust the precipitation on the bottom of units.
申请公布号 KR20000051800(A) 申请公布日期 2000.08.16
申请号 KR19990002439 申请日期 1999.01.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SA MUN;KIM, SU RYEON;KIM, SEUNG EON;LEE, JIN SEON
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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