LEAD FRAME STRUCTURE HAVING MULTI SEGMENT DIE PAD

摘要

PURPOSE: A lead frame is to prevent bending of a package body by providing a separate die pad to make flow rate of compound above and below the lead frame have little difference. CONSTITUTION: A lead frame of multi-segment die pad for holding a silicon chip(80) on its both sides comprises: a die pad segment(62a) arranged around a central part of the lead frame; many leads around the die pad segment; and a tie bar connected to the die pad segment. An entire area of the die pad segment is smaller than that of surface area of the silicon chip. After a wire bonded to the lead frame is laid into a mold(84), a compound(86) is injected into a packaging area of the lead frame through a gate(88) in the mold. Since the die pad segments are separated from each other, a friction force against a flow of the compound below the die pad segment becomes smaller. Thus, the flow rates above and below the segment have almost same value.