| 摘要 |
PURPOSE: An apparatus for inspecting a ball grid array is provided to inspect troubles of a welded ball array in the ball grid array to be used as a chip carrier for surface mounting of a semiconductor package and to obtain a three dimensional information from the ball grid array image information by using a single CCD camera. CONSTITUTION: An apparatus for inspecting a ball grid array includes two illuminating elements(34a,34b) for illuminating images on a body of the ball grid array(14), a pair of first optical elements(30a,30b) radiating the light beams from the illuminating elements on the body of the ball grid array for changing passages of light beams reflected from the ball grid array, a single second optical element(32) for reflecting the light beams from the first optical elements with a same predetermined angle to be advanced on a same plane parallel, and a signal image forming element for photographing images(36a,36b) with the parallel light beams on a same frame simultaneously.
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