METHOD FOR FORMING METALLIC WIRE BY TREATING PLASMA OF SEED LAYER

摘要

PURPOSE: A method for forming a metallic wire by treating a plasma of a seed layer is provided to remove a overhang situation on the seed layer and prevent the void from being formed in a contact plug thereby. CONSTITUTION: A method for forming the metal wire by the plasma treatment of the seed layer contains the following steps: a step to form the seed layer with vapor-depositing a conductor by physical vapor deposition on the top of inter-layer dielectric which has a contact hole exposing a partial conduction layer on the semi-conductor substrate, and at inner surface of the contact hole; a step to form the seed layer which does not generate the overhang situation by the plasma treatment of the seed layer; and a step to form the contact plug which is buried(fills up) by vapor-depositing the conductive substance on the seed layer to be treated by plasma, and the conductive layer to be extended from the top of the inter-layer dielectric and the contact plug.