| 摘要 |
PROBLEM TO BE SOLVED: To secure an inspection environment equivalent to a normal- temperature condition even during an IC wafer test requiring a high- or low- temperature condition by providing a heat shielding means for shielding convection heat transferred from a wafer chuck between the wafer chuck and a probe card held by a probe card holder. SOLUTION: An electrical test is conducted by probing pads of an IC chip on an IC wafer 500 with a probe card 300 which uses a probe card holder 200 equipped with a heat shielding plate 100. Since the holder 200 equipped with the plate 100 is provided within a prober, convention heat received by the plate 100 from a wafer chuck 600 is transferred to the holder 200, and is processed by a forced room temperature adjusting mechanism within the prober. Even if temperature environments for testing chips are different, there is no need to change probing conditions.
|
