| 摘要 |
PROBLEM TO BE SOLVED: To raise the connection strength after mounting and the reliability, and also to dispense with the work in the process after connection. SOLUTION: This package is a BGA(ball grid array)-type semiconductor package or an LGA( land grid array)-type semiconductor package which is equipped with reinforcing leads for securing the fixation to a mounting board, at the two corners at least of a semiconductor package substrate 2. Here, the open end of the reinforcing lead installed at the corner of the substrate of the BGA-type semiconductor package 1 is inserted and soldered into the through hole being made in advance when it is mounted on the mounting board, or it is soldered in the specified section of the surface of the mounting board. Thus, this semiconductor package is reinforced to external stress.
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