发明名称 TWO-SPINDLE PROFILE GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a two-spindle profile grinding device capable of efficient and uniform grinding by making almost the whole area of a grinding wheel put into contact with a workpiece, in the case that an inner/outer surface of the workpiece is not an accurate cylindrical surface. SOLUTION: A plate 11 is mounted in a moving base moved in the lengthwise direction of a workpiece through a four-section parallel link, a turn plate 14 mounting a grinding head 15 having a spindle 17 with a grinding wheel 19 is pivotally mounted on the plate 11. An axial profiling mechanism of the grinding head 15 energizing the turn plate 14 to a neutral position before turning and a position profiling mechanism of the grinding head 15 energizing the grinding wheel 19 of the grinding head 15 to the direction abutting to an outer surface of the workpiece are provided.
申请公布号 JP2000225551(A) 申请公布日期 2000.08.15
申请号 JP19990029871 申请日期 1999.02.08
申请人 TOSHIBA CERAMICS CO LTD 发明人 OTSU AKIRA;OSHIMA YASUTAKE
分类号 B24B47/10;B24B17/02;(IPC1-7):B24B17/02 主分类号 B24B47/10
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