发明名称 MANUFACTURE OF GaN FILM
摘要 PROBLEM TO BE SOLVED: To realize a higher growth rate and improve crystallinity by loading a sapphire substrate within a reactor, supplying a mixed gas to NH3 gas and HCl into the reactor to process the sapphire substrate and realizing growth of GaN film on the processed sapphire substrate. SOLUTION: A sapphire substrate is loaded (S10) within a reactor and such a sapphire substrate is processed with the NH3 gas into the primary nitride (S20). The surface of this sapphire substrate is processed with a mixed gas of NH3 and HCl (S31), thereafter process is performed (S32) for attaining the secondary nitride (S32). The GaN film is caused to grow on the sapphire substrate of the secondary nitride (S40). Namely, the sapphire substrate is loaded to the reactor before the growth to execute the surface process with the mixed gas of NH3 and HCl (S31) and thereafter the additional process to obtain nitride is executed (S30) to realize growth of a crystal face and during this process, the temperature of the source, the growth temperature and the rate of group III elements and group V elements are adjusted.
申请公布号 JP2000228367(A) 申请公布日期 2000.08.15
申请号 JP20000027692 申请日期 2000.02.04
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RI SEIKOKU
分类号 C30B25/02;C30B29/38;H01L21/20;H01L21/205;H01L21/86;H01L33/32;H01L33/34;H01S5/323 主分类号 C30B25/02
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