POSITION DETECTING METHOD, POSITIONING METHOD AND ALIGNER

摘要

PROBLEM TO BE SOLVED: To enable accurate positioning of a wafer by executing position detection of mark having formed a surface layer film using a position detecting offset after formation of the surface layer film in the mark forming area on the wafer. SOLUTION: A wafer is supplied to a stepper ST to detect an alignment mark signal with an alignment scope and a signal information of the alignment mark is sent to an offset analyzer OA from the stepper ST. Subsequently, from the three-dimensional relative positional relationship of the resist obtained previously with an offset analyzer OA and a wafer mark, relationship between the alignment mark signal and the wafer mark position is obtained to calculate the offset in the alignment measurement and it is then sent to the stepper ST. The stepper ST executes the exposure through alignment based on such an offset and thereafter carries the wafer to a developer DV for the purpose of development. The circuits are then formed through several processes and thereby a semiconductor device can be obtained.