| 摘要 |
PROBLEM TO BE SOLVED: To secure the connection between the common conductor layer at each flank of a rectangular insulating substrate and a conducting arm, and besides, minimize the waste of plated metal. SOLUTION: A part of the common conductor 16 made at each flank 15 of a rectangular insulating substrate 13 is made wider than other section. Further, it is made to pull down from the end of the flank, a conducting arm 17 is brought into contact with the wide part 160, and electroless plating is applied to a lead pin 12, etc. Furthermore, a wiring board 11 is fixed to a cylindrical rack for a cathode by catching the flanks of the opposite two sides of the rectangular insulating board 13 with the conducting arms 17, and electrolytic plating is performed while rotating this rack.
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