| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooling device capable of being housed in a housing small in space and improving cooling efficiency by radiating heat generated by an electronic component to the outside with high transportation efficiency. SOLUTION: One terminal part 4a on the heat-enter side of a heat pipe 4 is contacted to an electronic component 1 while enabling heat transmission. In this case, between the electronic component 1 and one terminal part 4a on the heat-enter side of the heat pipe 4, a cooling element 2 is interposed for elevating the temperature of one terminal part 4a on the heat-enter side of the heat pipe 4 rather than the temperature of the electronic component 1 by absorbing the heat generated by the electronic component 1 and generating heat at one terminal part 4a on the heat-enter side of the heat pipe 4. Then, another terminal part 4b on the radiation side of the heat pipe 4 is extended to a radiation part 5.</p> |
