| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of high-density mounting on a mother board. SOLUTION: This semiconductor device is provided with a plurality of inner bump electrodes 2 on the main face and a plurality of outer bump electrodes 3, a finger electrode 4, and circuit wiring to connect the outer bump electrode 3 with the finger electrode 4. An interposer 5 is connected through an inner bump 2a to the main face of the semiconductor chip 1 covering the rear with an insulating film exclusive of the outer bump electrodes 3 and the finger electrode requiring electric connection. A finger electrode 7 provided at the periphery of the interposer 6 and the finger electrode 4 provided at the periphery of the rear 1 of the semiconductor chip are connected with each other by a wire 8. These semiconductor devices are piled up in two stages or more in vertical direction, and the outer bump electrode 3 of the semiconductor device on the lower stage and the interposer 6 of the semiconductor device on the upper stage are electrically connected with each other through a solder bump 10, whereby multistage semiconductor device materializes, and the high-density mounting on the mother board 20 becomes possible.
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