发明名称 |
Integrated circuit subassembly with thermally anisotropic heat transfer element |
摘要 |
An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the fibers and the resin to create a formable resin/fiber compound. The resin/fiber compound is formed into a composite material in part by applying pressure to the formable resin/fiber compound, which aligns the fibers, and when cured creates a thermally anisotropic composite material to maximize heat conduction along the aligned fibers. The thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10x10-6 cm/cm/ DEG C. The composite material has a thermal conductivity in the direction of the carbon fibers of at least 50 W/m DEG K. The IC device is preferably secured to the heat transfer element using a thermally conductive adhesive.
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申请公布号 |
US6104090(A) |
申请公布日期 |
2000.08.15 |
申请号 |
US19980097844 |
申请日期 |
1998.06.15 |
申请人 |
BRYTE TECHNOLOGIES, INC. |
发明人 |
UNGER, SCOTT M.;RIDDLE, GUY T. |
分类号 |
H01L23/373;(IPC1-7):B32B9/00;B32B5/16;H01L21/44 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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