发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide epoxy resin compositions which are excellent in heat stability without curing in the cylinder of an injection molding machine and have curing characteristics of a latent type to quickly advance curing reaction in a die and enable continuous injection molding. SOLUTION: Epoxy resin compositions comprise (A) an epoxy resin, (B) a curing agent, and (C) a curing accelerator composed of a urea compound to be obtained by reacting a substituted or non-substituted phenylene diisocyanate with imidazole or an imidazole derivative in which one or two hydrogen atoms bound with the carbon atoms constituting the imidazole ring have been substituted with a 1-4C alkyl group or an acid-treated product of the urea compound.
申请公布号 JP2000226433(A) 申请公布日期 2000.08.15
申请号 JP19990029748 申请日期 1999.02.08
申请人 MITSUI CHEMICALS INC 发明人 URAKAWA TOSHIYA;TOGASHI EIKI;SAKURABA TSUKASA
分类号 B29C45/00;B29K63/00;C08G59/40;(IPC1-7):C08G59/40 主分类号 B29C45/00
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