发明名称 |
ASSEMBLING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an assembling method by which a printed board 20 can be laid on top of a case with high workability. SOLUTION: In an assembling method, a printed board 20 is laid on top of a case by sliding the board 20 on position control bars 3 composed of round bars, in such a way that the recessed sections 23 of the board 20 are slid on the bars 3 by using an aligning jig 1. The position control bars 3 are arranged in the jig 1 in parallel with each other at fixed relative intervals and respectively forming recessed sections 12 and 23 in a case 10. The board 20 at the positions corresponding to the bars 3 in accordance with the partial cross-sectional shapes of the bars 3 by the same number as that of the bars 3.
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申请公布号 |
JP2000228590(A) |
申请公布日期 |
2000.08.15 |
申请号 |
JP19990029294 |
申请日期 |
1999.02.05 |
申请人 |
HARNESS SYST TECH RES LTD;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD |
发明人 |
NAKANO TAKENARI;HIRAMATSU SHINYA |
分类号 |
H05K7/14;(IPC1-7):H05K7/14 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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