发明名称 MOLDED-IN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a molded-in molding wherein a connection region of a connection member is never flawed by a die even if a normal die to which a countermeasure is not implemented is used. SOLUTION: In relation to a molded-in molding 1 composed by enclosing at least a part of a connection member 3 by a molding resin 4 such that predetermined parts 31 of the connection member 3 used for electrical connection are exposed, a feature of this mold is that connection regions 31a with which actual electrical connection is carried out within the predetermined parts 31 are formed into recessed parts. Thereby, since the connection regions are formed into the recessed parts, the connection regions are prevented from being damaged during molding-in molding.
申请公布号 JP2000228240(A) 申请公布日期 2000.08.15
申请号 JP19990029981 申请日期 1999.02.08
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 KUROIWA MASAKAZU;TAKEGAWA KATSUMI
分类号 H01R13/405;H01R13/504;(IPC1-7):H01R13/405 主分类号 H01R13/405
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