发明名称 THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming device free from the generation of the variation of the film thickness of a product in accordance with the kinds of the targets to be used and using periods. SOLUTION: This thin film forming device 20 in which the member to be film-formed is arranged opposite to targets 22 and 23 arranged in a vacuum chamber 21, and a film is formed while the material to be film-formed is relatively moved to the target, correcting boards 35 and 36 are arranged on the spaces between the targets and the material to be film-formed, and the shapes of the correcting boards are made deformable.
申请公布号 JP2000226651(A) 申请公布日期 2000.08.15
申请号 JP19990028683 申请日期 1999.02.05
申请人 SEIKO EPSON CORP 发明人 MIYASAKA SHINICHI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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