FLATNESS MEASURING DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a flatness measuring device capable of accurately predicting and measuring the flatness of semiconductor wafer during drawing. SOLUTION: When the distribution of surface height of semiconductor wafer 20 is measured, the same measuring point as a specific point for measuring with a focus sensor is selected (S2) from all measuring points during drawing. Based on the measured results, a flatness judgment standard plane R2 of the semiconductor wafer 20 is operated (S3). Then a displacement in the drawing area against the flatness judgment standard plane R2 is measured (S4). Flatness of the semiconductor wafer during drawing is predicted and measured (S5) from the measured displacement.