| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a semiconductor device to be equipped with a lead which shows enough junction strength to a circuit board regardless of the kind of solder or micronization. SOLUTION: This device is mainly composed of a lead frame which includes a lead part connected onto the conductor of a circuit board 1 and a land part to mount a semiconductor element, and a sealing part which seals the semiconductor element mounted on the land part. The lead part of this lead frame is composed of an inner lead covered with sealing resin 2 and an outer lead 3 exposed from the sealing resin 2. The outer lead 3 of this device is roughly J-shaped, and a surface area increasing region 3a is made at the section to contact with solder 4.</p> |
