| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic equipment cooling device capable of reducing the producing cost of an electronic equipment as a while making the electronic equipment thin in thickness, and to provide a keyboard unit attached to the electronic equipment using the cooling device. SOLUTION: In this cooling unit 10, heat is transferred to a heat sink by an endothermic plate 21 and a heat pipe 23, which are connected to a CPU 19, to be heated inside a notebook-sized PC 1 to heat the heat sink by the heat transfer. The heated heat sink is forcedly cooled by receiving air blown by a cooling fan inclined just at an inclination angleαby a fan supporting part 24d, and heated air is almost horizontally guided through an exhaust passage 24e by forced cooling and exhausted from an exhaust hole 8 to the outside of a casing 2. With this exhaustion, the portion of a keyboard 4 located above the CPU 19 is prevented from being locally heated, thus, unpleasant feelings are prevented from being given to the tips of fingers of an operator.</p> |
