| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat sink without sacrificing large irregularity and heat transfer perfor by forming the tip of each divided unit heat sink in square block structure, connecting the square blocks so that one direction of each of the square blocks does not touch each other, and surrounding the square block of each group of heat sinks being divided for formation. SOLUTION: A plurality of LSIs 2a-2e are packaged on a printed circuit board 1, and a plurality of unit heat sinks 11 being divided in a matrix are arranged in an outer frame 10 of a heat sink 9. Then, the tip of each divided unit heat sink 11 formed in a square block 13 in contact with a subject to be cooled, and the square block 13 is brought into contact with the bottom surfaces of the LSIs 12a-12e so that it goes up and down each unit heat sink 11. As a result, each unit heat sink 11 brings the square blocks 13 in contact one another on their side surfaces for transferring heat and they support one another so that they do not fall.
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