发明名称 METHOD AND EQUIPMENT FOR MANUFACTURING ELECTRONIC DEVICE DEVICE
摘要 PROBLEM TO BE SOLVED: To efficiently manufacture an electronic device where plural groups of solder balls are transcribed and made at regular pitches on a substrate. SOLUTION: A sucker 10 for multiregion capable of sucking plural groups of solder balls 2 at regular pitches is prepared, and it is checked whether the pitch between the adjacent connection regions out of connection regions for every solder ball group on a substrate 4A is fixed or not with a camera 63, and the solder ball group slated to be connected to the connection region being judged that the pitch to the adjacent connection region is not fixed as the result of inspection out of the plural solder ball groups sucked by the sucker 10 is excluded with a removing mechanism 40. Then, the solder ball groups sucked by the sucker 10 are transcribed en block to the connection region of the board 4A.
申请公布号 JP2000228456(A) 申请公布日期 2000.08.15
申请号 JP19990027741 申请日期 1999.02.04
申请人 HITACHI LTD;HITACHI VIA MECHANICS LTD 发明人 MORISHIMA MASAYUKI;SUZUKI TAKAMICHI;FUJII TERU;DAIROKU NORIYUKI;INOUE KOSUKE;TSUCHIYA AKIRA
分类号 H01L23/12;H01L21/50;H05K3/34;(IPC1-7):H01L23/12 主分类号 H01L23/12
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