| 摘要 |
PROBLEM TO BE SOLVED: To positively efficiently obtain a semiconductor device from a workpiece by a method, wherein the work is carried by accurately positioning the position of a trimming die. SOLUTION: In an apparatus for processing a semiconductor device in which a workpiece 14, in which a plurality of semiconductor elements are sealed and mounted on a substrate at predetermined intervals, is punched by use of a die to form a semiconductor device, as a carrying mechanism for carrying by positioning the workpiece 14 at a process position of the die, there are provided a support frame 26 for supporting the workpiece and X-Y carrying apparatus 28, 30, 32 for moving this support frame in the X-Y direction on a carrying face without changing a carrying height position, and as the die, there are provided a die and a punch provided so as to attach and detach to the workpiece, and a drive mechanism for vertically driving so as to match the timings of the die and punch and the carrying face of the workpiece as a process face.
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