| 摘要 |
PROBLEM TO BE SOLVED: To effect sure junction between a ceramic plate and an aluminum plate by using a bonding material having thermal stress buffering effect so as not to need to insert any intermediate material as a thermal stress buffering material such as Cu into the joint surface even in case the joint surface is broad or the subject junction form is used over a wide temperature range. SOLUTION: The junction between a ceramic plate 5 and an aluminum plate 3 is accomplished by the following process: because indium runs wet on the joint surface between the ceramic plate 5 and the aluminum plate 3, the joint surface is previously metallized with copper at <=500 deg.C; the joint surface thus metallized is preliminarily soldered with indium; the resulting system is fixed onto a jig 2 and set on a press machine equipped with a vacuum chamber 10 and a hot plate 1; the system is then preheated to about 170-200 deg.C using the hot plate 1 and the preliminarily soldered surface of the ceramic plate 5 is cast with a molten indium 4 in a separate container; the vacuum chamber 10 is then actuated and the jig 2 is allowed to descend and contacted with a junction thickness adjustment spacer 8; 2 to 5 minutes after the contact, the vacuum is released, thereby effecting the objective good junction.
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