VACUUM STENCIL PRINTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a vacuum stencil printing method which does not only prevent unfilled portions or voids from remaining but also eliminate a tendency of quantity decrease of resin filled layers. SOLUTION: This vacuum stencil printing method used for filling a resin in an electronic part element mounted on a substrate 1 includes steps of operating a squeegee 5 under a vacuum atmosphere to press and fill a sealing resin 4 in a screen mask through hole 6, while forming an excessively supplied layer 8 of the sealing resin 4 on the stencil 3 in a layer; leaving the resin to stand for a while maintaining the degree of the vacuum or making it higher after the pressing and filling step; removing the sealing resin 4 of the excessively supplied layer 8 from the screen mask 3 after the step of leaving the resin to stand; and finally removing the stencil 3.