发明名称 Thermally conductive support structure
摘要 A structure for supporting and at least transferring heat energy away from at least a first heat source interconnected thereto is disclosed. In one embodiment, the structure includes a deck member having a plurality of layers of thermally conductive fibers packed within a matrix material. Fibers of at least a first layer are orientable to transfer heat energy toward at least a first sidewall of the deck member, and fibers of at least a second layer are orientable about +/-45 DEG relative to the fibers of the first layer to enhance the structural strength of the deck member. In another embodiment, fibers of at least a first layer of thermally conductive fibers of the deck member are orientable to transfer heat energy from a first heat source to a second, cooler heat source, both of which are interconnectable to the deck member, such that the first and second heat sources operate at substantially uniform temperatures. In this embodiment, fibers of at least a second layer of thermally conductive fibers are orientable about +/-45 DEG relative to the fibers of the first layer to enhance the structural strength of the deck member. Fibers of at least a third layer of thermally conductive fibers are orientable substantially orthogonally relative to the fibers of the first layer to transfer heat energy away from at least the first heat source to at least a first sidewall of the deck member.
申请公布号 US6102112(A) 申请公布日期 2000.08.15
申请号 US19980027830 申请日期 1998.02.17
申请人 LOCKHEED MARTIN CORPORATION 发明人 HERZL, ALFRED
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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