| 摘要 |
PROBLEM TO BE SOLVED: To shorten the production time by reducing the number of manufacturing processes as a whole, improve the precision in inspection by reliably screening defective memory cells, and guarantee the operation speed over the entire product operation guarantee period. SOLUTION: In the wafer test process, a VT screening process Tp1 is performed in a state a UV elimination process has not been performed in the diffusion process. Consequently, defective chips containing a memory cell having an abnormally high threshold due to a charge-up damage during the diffusion process can be screened, and the number of processes can be reduced in the diffusion process.
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