发明名称 PRODUCTION OF COPPER OR COPPER BASE ALLOY
摘要 PROBLEM TO BE SOLVED: To obtain a material for electrical parts requiring wear resistance and corrosion resistance by coating copper or a copper base alloy with Sn, thereafter executing heat treatment in an atmosphere in which the concn. of oxygen is controlled to the ratio equal to or below the specified one and forming an oxidized film on the outermost surface and an intermetallic compd. layer essentially consisting of Cu-Sn on the inside thereof. SOLUTION: Copper or a copper base alloy is coated with Sn, and, after that, heat treatment is executed in an atmosphere of <=5% oxygen concn. to form an oxidized film of 10 to 1000 nm thickness on the outermost surface and an intermetallic compd. layer essentially consisting of Cu-Sn on the inside thereof. The thickness of the intermetallic compd. layer essentially consisting of Cu-Sn to be formed on the inside of the oxidized film is preferably controlled to 0.1 to 10μm. Furthermore, the heat treating temp. and time for forming the intermetallic compd. layer essentially consisting of Cu-Sn are prefearbly controlled to 100 to 700 deg.C and 1 to 24 hr. The copper or copper base alloy coated with Sn obtd. by this method is excellent in surface hardness, contact resistance, bending workability, adhesion and inserting force.
申请公布号 JP2000226645(A) 申请公布日期 2000.08.15
申请号 JP19990063760 申请日期 1999.02.03
申请人 DOWA MINING CO LTD;YAZAKI CORP 发明人 SUGAWARA AKIRA;HANA YOSHITAKE;ENDO RYUKICHI
分类号 C22F1/00;C22C9/00;C22F1/02;C22F1/08;C23C26/00;C25D5/50;H01R13/03;(IPC1-7):C22F1/08 主分类号 C22F1/00
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