| 发明名称 |
EPOXYHARZMASSEN ZUR EINKAPSELUNG VON HALBLEITERN, DEREN HERSTELLUNG UND VERWENDUNG, SOWIE DAMIT EINGEKAPSELTE HALBLEITERBAUTEILE |
| 摘要 |
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability. |
| 申请公布号 |
AT195138(T) |
申请公布日期 |
2000.08.15 |
| 申请号 |
AT19960301611T |
申请日期 |
1996.03.08 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;CIBA SPECIALTY CHEMICALS HOLDING INC. |
发明人 |
ASANO, EIICHI;AOKI, TAKAYUKI;SHIOBARA, TOSHIO;FLURY, PETER;SCHARF, WOLFGANG;OKADA, TADASHI |
| 分类号 |
C08G59/30;C08G59/32;C08K5/00;C08K5/523;C08L63/00;H01L23/29;(IPC1-7):C08K5/523;H01B3/40;C08L63/02;H01L21/00 |
主分类号 |
C08G59/30 |
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