发明名称 |
Apparatus and method for controlling polishing of integrated circuit substrates |
摘要 |
A system for polishing a surface. The surface is positioned in contact with a rotating table having a polishing slurry or compound applied to a table surface. The pattern formed in the polishing compound as the table is rotated is monitored, and when the pattern dimensions reach a predetermined size, indicating a polished end point, the polisher ends polishing.
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申请公布号 |
US6102776(A) |
申请公布日期 |
2000.08.15 |
申请号 |
US19990225597 |
申请日期 |
1999.01.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOGGS, KARL E.;DAVIS, KENNETH M.;LANDERS, WILLIAM F.;MERKLING, JR., ROBERT M.;PASSOW, MICHAEL L.;STEPHENS, JEREMY K. |
分类号 |
B24B37/04;B24B49/04;B24B49/10;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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