| 摘要 |
PROBLEM TO BE SOLVED: To properly hold, carry and cool a wafer after formation of an optical disc, etc., while preventing generation of deformation, cracks, etc., thereof. SOLUTION: In the devices 20a, 20b, suction boards 21a, 21b formed in a vertical direction such and hold a formed wafer 30 of a high temperature vertically by vacuum suction in contact with a plane part of the wafer 30. Thermal conductivity of at least a part of the suction boards 21a, 21b in contact with the wafer 30 is formed of a member of low thermal conductivity which is lower than that of metal and close to thermal conductivity of a material of the wafer 30, and deformation of the wafer 30 is prevented by restraining generation of temperature difference between a contact part and a non-contact part to the wafer 30. When the wafer 30 held by the wafer holding/carrying device 20a at a delivery side is delivered to the wafer holding/carrying device 20b at a receiving side, both the suction boards 21a, 21b approach in opposition to each other with the wafer 30 between and deliver the wafer 30. Therefore, the wafer 30 can be delivered surely and rapidly without being bent and deformed. |
