发明名称 ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD-TIN ALLOY
摘要 PROBLEM TO BE SOLVED: To provide an aq. electroplating soln. for electroplating the coating films of bright tin and tin-lead alloy solder at a high speed, especially an electroplating soln. having a simplified chemical action to minimize the effect of org. matter on the solder coating film. SOLUTION: An electroplating soln. for plating coating films of bright tin, lead or tin-lead alloy for use in high-speed electroplating contains an alkane or alkanolsulfonic acid electrolyte, a nonionic surfactant, a grain comminuting agent and two kinds of brighteners, i.e., an aromatic aldehyde and a carboxylic acid. In one way of using the electroplating soln., methanesulfonic acid is used as the sulfonic acid electrolyte, octylphenoxy(10)polyethoxyethanol as the nonioic surfactant, phenolphthalein as the grain comminuting agent, chlorobezaldehyde as the aromatic aldehyde and methacrylic acid as the carboxylic acid.
申请公布号 JP2000226686(A) 申请公布日期 2000.08.15
申请号 JP20000027522 申请日期 2000.02.04
申请人 LUCENT TECHNOL INC 发明人 ABYS JOSEPH ANTHONY;KENNETH J MULSKI;ZHANG YUN
分类号 C25D3/32;C25D3/36;C25D3/56;C25D3/60;H05K3/34;(IPC1-7):C25D3/32 主分类号 C25D3/32
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