| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject substrate with improved thermal conductivity by junction between aluminum and a ceramic through a lead borosilicate glass- contg. brazing material. SOLUTION: This aluminum-ceramic junction substrate is obtained by the following process: the surface of a ceramic substrate is coated with a blazing material prepared by incorporating lead borosilicate glass in an Al-based or Al-Si-based brazing material, an Al plate is then contactedly disposed on the blazing material, and the resulting substrate is subjected to junction under heating in a vacuum followed by etching to make a specified circuit pattern, wherein the lead borosilicate glass contains pref. >=70 wt.% of lead oxide. The ceramic substrate to be favorably used is an aluminum nitride substrate. The void content at the junction interface of this junction substrate thus obtained is very low and the maximum void size is very small as well. This is because use of the glass component-contg. brazing material brings about a glass bond junction state and results in effectively suppressing void generation.
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