发明名称 POSITIVE PHOTORESIST COMPOSITION FOR EXPOSURE TO FAR ULTRAVIOLET
摘要 PROBLEM TO BE SOLVED: To provide the positive photoresist composition for far ultraviolet exposure prevented from occurrence of development defects and scum at the time of development by incorporating alkali-soluble groups protected with partial structures containing specified alicyclic hydrocarbons and resins to be decomposed by acid action and raised in solubility in alkali. SOLUTION: This composition contains a compound to be allowed to generate an acid by irradiation with activated rays or radiation, and the resin having the alkali-soluble groups protected with at least one of partial structures containing the alicyclic hydrocarbons represented by formulae I-III and the like, and the resin to be decomposed by acid action and to be raised in solubility in alkali and a compound to be decomposed by acid action and to generate solfonic acid. In formulae I-III, R11 is a methyl or ethyl group or the like; Z is an atomic group necessary to form the alicyclic hydrocarbon group together with the carbon atoms; each of R12-R16 is a 1-4C straight or branched alkyl or alicyclic group, and at least one of R12-R14 or one of R15 and R16 is an alicyclic group.
申请公布号 JP2000227659(A) 申请公布日期 2000.08.15
申请号 JP19990030209 申请日期 1999.02.08
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO;OHASHI HIDEKAZU;AOSO TOSHIAKI
分类号 G03F7/027;G03F7/039 主分类号 G03F7/027
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