MANUFACTURE OF PIEZOELECTRIC BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric board by which the piezoelectric substrate is machined into a thin layer at a specified thickness while keeping the flatness, parallelism and surface roughness necessary for piezoelectric devices without cracks or chipping. SOLUTION: A piezoelectric substrate 101 having a blind groove 103 with a specified depth and a specified auxiliary substrate 102 are prepared, and a planned joint surface on which the blind groove 103 of the board 101 is formed is directly adhered to a planned joint surface 112 of the substrate 102, and then at least the bottom part of the blind groove 103 of the board 101 is removed from the machined surface opposite to the surface 111 and the substrate 101 is ground until it becomes thin as specified, and finally the substrate 102 is cut at a position corresponding to the position where the blind groove 103 of the substrate 101 is formed.