| 摘要 |
An epoxy resin composition comprising (1) an epoxy resin, (2) a polymer obtained by reacting a polycarbodiimide with a compound having, in the molecule, at least one group reactive with carbodiimide group, between the carbodiimide group of said polycarbodiimide and the group reactive with carbodiimide group, of said compound, and (3) a curing agent for epoxy resin. The above epoxy resin composition alleviates the problems of the prior art; has a long pot life in a solution state, has an appropriate gelling time and accordingly good workability, is superior in film formability and handleability in B-stage, and has high heat resistance after curing; therefore, is suitably used in printed wiring board, prepreg, etc.
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