发明名称 WIRE BONDING METHOD AND APPARATUS FOR ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To prevent a ball at a distal end of a metal line from being out of position with respect to a second bonding section by causing the ball to be pushed downward by an inclined surface which is obliquely inclined downward with respect to a first bonding section and which extends so as to reach a substantially central portion of the metal line. SOLUTION: A bonding tool 10 has such a large width W as to reach a substantially central portion of a metal line 6 with respect to a first bonding section 4. On the other hand, the underside of the tool 10 is formed into an inclined surface 10A which is obliquely inclined upward at an appropriate angle θwith respect to the section 4. Even when the line 6 is insufficiently bent, a ball 6B at a distal end of the line 6 abuts the surface 10A of the tool 10 without fail, and thus when the tool 10 moves downward, the line 6 is bent downward. As a result, the ball 6B can be bonded to a second bonding section 5 reliably.
申请公布号 JP2000223521(A) 申请公布日期 2000.08.11
申请号 JP19990022464 申请日期 1999.01.29
申请人 ROHM CO LTD 发明人 MUTAGUCHI YOSHIHIKO
分类号 H01L21/60;B23K9/127;B23K9/32 主分类号 H01L21/60
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