发明名称 WIRE BONDER
摘要 PROBLEM TO BE SOLVED: To provide a wire bonder, capable of detecting every one of bonding wires formed into abnormal loops longer than a specified length. SOLUTION: This bonder comprises a capillary 3 which has a through-hole 3a and moves along a specified route with feeding a bonding wire 4 from the through-hole 3a to form a loop of the wire 4 in a specified shape, a tension gage 1 capable of measuring the tension of the bonding wire 4 caused by contacting the bonding wire 4 to the through-hole 3a of the capillary 3 in forming the loop of the bonding wire 4, and control means for detecting an abnormality, based on the value of the tension and executing specified controls.
申请公布号 JP2000223523(A) 申请公布日期 2000.08.11
申请号 JP19990025579 申请日期 1999.02.02
申请人 NEC CORP 发明人 KATO DAIZO
分类号 H01L21/60 主分类号 H01L21/60
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