发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To accurately mount electronic parts on their mounting positions provided on a substrate. SOLUTION: After substrate recognizing points 118 on a substrate 103 and parts recognizing points 117 on electronic parts 102 are recognized, the points 118 and 117 are moved to their designed positions. After movement, the parts recognizing points 117 are again recognized from an picked-up image and the re-recognized positions of the points 117 are found. Then the electronic parts 102 are mounted on the substrate 103 based on the found re-recognized positions. Since the re-recognized positions are used, the accuracy of the mounting position of the parts 102 can be improved as compared with the case where the parts 102 are mounted on the substrate 13 by only moving the points 117 to their designed positions.
申请公布号 JP2000223896(A) 申请公布日期 2000.08.11
申请号 JP19990026149 申请日期 1999.02.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUEDA NOBUO;HIRATA SHUICHI;WADA HIROSHI
分类号 B23P19/00;H05K13/04 主分类号 B23P19/00
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