| 摘要 |
PROBLEM TO BE SOLVED: To enable columnar electrodes of a semiconductor device to absorb stresses. SOLUTION: A resin seal film 17 is formed, using a printing mask 14 and a squeegee 15. The mask 14 has a thickness adequately less than the height of columnar electrodes 12, and hence the top faces of the electrodes 12 are covered with the resin seal film 17 but the thickness of the seal film 17 between the columnar electrodes 12 is adequately less than the height of the columnar electrodes 12. Since the thickness of the seal film 17 between the columnar electrodes 12 is adequately less than the height of the columnar electrodes 12, the columnar electrodes 12 can absorb stresses, due to the thermal expansion coefficient difference between the Si substrate 11 and a circuit board in a temp. cycle test after mounting on the circuit board.
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