| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a very small chip scale IC package only slightly larger than a chip contained therein by filling the gap between chips with an insulating material to cover the element surface of two chips while exposing the back face thereof thereby forming an insulation compound. SOLUTION: First and second chips 50, 52 have element surfaces 60, 62 facing the opposite side face of a film carrier 58 and bonding pads of two chips 50, 52 are connected electrically with a conductive wire 56 on a film carrier 58 through first and second conductive protrusions 64, 66. An insulating material fills the space between two chips 50, 52 to form an insulation compound 68. The insulation compound 68 seals only the conductive protrusions 64, 66 and the element surfaces 60, 62 of the chips 50, 52 such that the back faces 70, 72 of the first and second chips 50, 52 are exposed.</p> |
