| 摘要 |
PROBLEM TO BE SOLVED: To shorten the working hour at the time of sealing a plurality of circuit boards housed in a case in a state where the boards are piled upon another at prescribed intervals with a sealing material and, in addition, to eliminate the adverse influence of bubbles left in the sealing material on circuit sections. SOLUTION: Bubbles 61 left in an Si(silicon) gel (sealing material) 60 on the rear surface side of the upper one 50 of two circuit boards 20 and 50 housed in a case 10 get away of the gel 60, namely, to the atmosphere through vent holes 55 bored through the board 50 before the bubbles 61 grow larger. Consequently, the bubbles 61 left in the gel 60 on the rear surface side of the board 50 can be prevented from growing to such a degree that the bubbles 61 come into contact with Au (gold) wires 22 in an IC chip 21. Therefore, electronic control equipment 100 can achieve a perfect moisture preventive structure with the Si gel 6 and, in addition, the reliability of products can be improved.
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