发明名称 ARRANGEMENT STRUCTURE OF ELECTRONIC APPARATUS IN CASING
摘要 PROBLEM TO BE SOLVED: To smooth flow an air by a method wherein a power supply circuit is arranged in a casing main body, and an integrated drive and the other electronic apparatus are attached to a chassis away from the chassis, taking into consideration a heat effect. SOLUTION: An integrated drive 3 of a CD and a power supply circuit 4 are arranged in sequence on a chassis 1 rearwardly from a front face panel 2, and the power supply circuit 4 and integrated drive 3 are separated by a predetermined distance from the chassis 1 by respective members. In the members in this case, a periphery of the integrated drive 3 is pressed by a screw 9, etc., from left and right by a support plate 8 bent in the integrated drive 3. One of the integrated drives 3 is connected to a flat cable 6 connected to a connector 5 of the chassis, and the chassis 1 is lidded by a lid casing 7 to structure a CD drive. Thus, it is possible to smooth flow an air in the casing main body, and to dissolve a heat effect in the casing main body.
申请公布号 JP2000223868(A) 申请公布日期 2000.08.11
申请号 JP19990018723 申请日期 1999.01.27
申请人 TOOKADO:KK 发明人 ENDO HIROSHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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